Medical Device PCB Assembly
Extra care must be taken to ensure reliability when medical PCB assembly. This is because human life depends on the equipment that houses them. This is especially true for those used in implants. First, they must be hygienic. They also have to be more compact than usual. Therefore, HDI (High Density Interconnect) PCB assembly are used in most medical devices.
| Plate | Shengyi S1000H |
| Plate thickness | 1.6mm |
| Size | 216.3*92.6mm |
| Minimum aperture | 0.1mm |
| Line width/moment | 0.1/0.1mm |
| Surface treatment | Immersion silver |
Prototype to Full Turn-Key Assembly
Through-Hole Lead-Free Wave Soldering
Best Price, Genuine Components
Quality Accreditation ISO9001
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Description
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Specification
Extra care must be taken to ensure reliability when medical PCB assembly. This is because human life depends on the equipment that houses them. This is especially true for those used in implants. First, they must be hygienic. They also have to be more compact than usual. Therefore, HDI (High Density Interconnect) PCB assemblies are used in most medical devices.
Equipment Capacity
Production Process
| ltem | Capability |
|---|---|
| Layer Count | 1-40layers |
| Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers4000、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material (including partial Ro4350B hybrid laminating with FR-4) |
| Board Thickness | 0.2-5.0mm |
| Copper Thickness | Min. 1/2 OZ, Max. 10 OZ |
| PTH Wall | 25um(1mil) |
| Maximum Board Size | 1100*500mm(43”*19”) |
| Min laser drilling size | 4mil |
| Min.spacing/Tracing | 2.7mil/2.7mil |
| Solder Mask | Green, Black, Blue, Red, White, Yellow, Purple matte/glossy |
| Surface Treatment | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead-free 、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP, ENIG+Gold finger, Flash gold(electroplated gold)+Gold finger(50u”), Immersion silver+Gold finger, Immersion Tin+Gold finger |
| Min. Annular Ring | 3mil |
| Aspect ratio | 10:1(HASL Lead-free 、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) |
| Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) |
| Other Techniques | Blind/Buried Via, Gold Fingers, Press Fit, Via in Pad, Electrical Test |
