Communication Motherboard Turnkey PCB Assembly
The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from bottom to top in order from top to bottom. The positioning circuit layer, the second outer wire layer, the bottom surface of the substrate The second layer of solder resist ink layer, the substrate includes a high-frequency area and an auxiliary area, the auxiliary area is finally fixed, and the high-frequency area inlay should be located in a fixed position.
| Size | 50*50mm~510*460mm |
| Min Package | 01005 (0.4mm*0.2mm) |
| Mounting Accuracy | ±0.035mm(±0.025mm) |
| Processing Technology | Electrolytic Foil |
Prototype to Full Turn-Key Assembly
Through-Hole Lead-Free Wave Soldering
Best Price, Genuine Components
Quality Accreditation ISO9001
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Description
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Specification
The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from bottom to top in order from top to bottom. The positioning circuit layer, the second outer wire layer, the bottom surface of the substrate The second layer of solder resist ink layer, the substrate includes a high-frequency area and an auxiliary area, the auxiliary area is finally fixed, and the high-frequency area inlay should be located in a fixed position. The utility model provides a high-frequency hybrid splint, which is divided into two parts: a high-frequency area and an auxiliary area. Provide mechanical support. The utility model discloses that the high-frequency area is independently arranged, and only the high-frequency area is made of high-frequency materials. Under the condition of satisfying high-frequency signals, the use of high-frequency board materials is minimized and the production cost is reduced.
High Frequency Hybrid Product Classification Layers: 6 Layers Used Board: ro4350b +FR4 Thickness: 1.6mm Size: 210mm*280mm Surface Treatment: Gold-plated Minimum Aperture: 0.25mm Application: Communication Features: High Frequency Mixed Pressure
We provide Communication motherboard Turnkey PCB Assembly, turnkey pcb assembly services. New Reach is your one-stop Turnkey PCB assembly company.
| ltem | Capability |
|---|---|
| Order Quantity | ≥1PC |
| Quality Grade | IPC-A-610 |
| Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
| Size | 50*50mm~510*460mm |
| Board Type | Rigid PCB, Flexible PCB, metal core PCB |
| Min Package | 01005 (0.4mm*0.2mm) |
| Max Package | No limit |
| Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS, etc. |
| Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
| Component Sourcing | Turnkey (All components sourced by New Reach), Partial turnkey, Kitted/Consigned |
| BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
| SMT Parts Presentation | Cut Tape, Partial reel, Reel, Tube, Tray, Laser-cut Stainless Steel |
| Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical and entertainment. |
| Stencil | Stencil with or without frame (offered free by New Reach) |
| Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
| SMT Capacity | 3 Million~4 Million Soldering Pad/day |
| DIP Capacity | 100 Thousand Pins/day |
