Car Driving Recorder HDI PCB Assembly
High-Density Interconnect (HDI) is simply a Car driving recorder HDI PCB assembly with a higher number of interconnects in the smallest footprint. This leads to the miniaturization of the circuit board. Components are placed closer together and board space is significantly reduced, but functionality is not compromised.
| Plate thickness | 1.6mm |
| Size | 242mm*165mm |
| Minimum blind hole | 0.1mm |
| Min Buried Via | 0.25mm |
| Minimum line width | 0.088mm |
| Minimum line spacing | 0.087mm |
Prototype to Full Turn-Key Assembly
Through-Hole Lead-Free Wave Soldering
Best Price, Genuine Components
Quality Accreditation ISO9001
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Description
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Specification
High-Density Interconnect (HDI) is simply a Car driving recorder HDI PCB assembly with a higher number of interconnects in the smallest footprint. This leads to the miniaturization of the circuit board. Components are placed closer together and board space is significantly reduced, but functionality is not compromised.
More precisely, a Car driving recorder HDI PCB with an average of 120 to 160 pins per square inch is considered an HDI PCB. HDI designs combine dense component placement and versatile routing. HDI popularized microporous technology. Create denser circuits by implementing micro vias, buried vias, and blind vias. Reduced drilling of copper in HDI designs.
What are the advantages of Car driving recorder HDI PCB?
1. Extraordinary Versatility: HDI boards are ideal when weight, space, reliability and performance are the main concerns.
2. Compact design: The combination of blind, buried and micro vias reduces board space requirements.
3. Better Signal Integrity: HDI utilizes via-in-pad and blind via technology. This helps keep components close to each other, reducing signal path lengths. HDI technology removes through-hole stubs, thus reducing signal reflections, thereby improving signal quality. Therefore, it significantly improves signal integrity due to shorter signal paths.
4. High reliability: The implementation of stacked vias makes these boards a super barrier against extreme environmental conditions.
5. Cost-effective: The functionality of a standard 8-layer through-hole board (standard PCB) can also be reduced to a 6-layer HDI board without compromising the quality.
| Feature | Capability |
|---|---|
| Material | FR-4 Standard Tg 140°C, FR4-High Tg 170°C |
| Min. Track/Spacing | For External layers: 4oz Cu 10mil/13mil, 5oz Cu 12mil/15mil, 6oz Cu 15mil/15mil For Internal layers: 4oz Cu 8mil/8mil, 5oz Cu 10mil/10mil, 6oz Cu 12mil/12mil |
| Min. Hole Size | 0.15 ~ 0.3mm |
| Max Outer Layer Copper Weight (Finished) | 12oz |
| Max Inner Layer Copper Weight | 12oz |
| Board Thickness | 0.6-6mm |
| Surface Finishing | HASL lead-free, Immersion gold, OSP, Hard Gold, Immersion Silver, Enepig |
| Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green |
| Silkscreen | White, Black |
| Via Process | Tenting Vias, Plugged Vias, Vias not covered |
| Testing | Fly Probe Testing (Free) and A.O.I. testing |
| Build time | 5-15 days |
| Lead time | 2-3 days |
