ARM Cortex A7 i.MX6 SOM BGA Assembly Ideal for IoT Gateway
The ARM Cortex-A7 i.MX6 System-on-Module (SOM) is a powerful embedded module commonly used in IoT (Internet of Things) gateways and other industrial applications. It features an ARM Cortex-A7 processor, which is known for its low power consumption and efficient performance.
Layers | 10 layers ENIG |
Order Quantity | ≥1PC |
Quality Grade | IPC-A-610 |
Module Size | 55.5*38.5*3mm |
Min Package | 01005 (0.4mm*0.2mm) |
Mounting Accuracy | ±0.035mm (±0.025mm) Cpk≥1.0 (3σ) |
Prototype to Full Turn-Key Assembly
Through-Hole Lead-Free Wave Soldering
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Description
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Specification
The ARM Cortex-A7 i.MX6 System-on-Module (SOM) is a powerful embedded module commonly used in IoT (Internet of Things) gateways and other industrial applications. It features an ARM Cortex-A7 processor, which is known for its low power consumption and efficient performance. Here’s some information about the module and its usage in an IoT gateway:
i.MX6 SOM Module:
- The i.MX6 SOM module is a small form factor module that integrates the ARM Cortex-A7 processor, along with other components such as RAM, flash memory, and various peripheral interfaces.
- It also provides a ready-to-use, compact, and cost-effective solution for embedding powerful computing capabilities into IoT devices and gateways.
- The module typically comes in a BGA (Ball Grid Array) package, which also requires specialized manufacturing processes for assembly onto a PCB.
ARM Cortex-A7 Processor:
- The ARM Cortex-A7 processor is a low-power, high-efficiency processor core designed for embedded and mobile applications.
- Moreover, it offers a good balance between performance and power consumption, making it suitable for IoT gateway applications where energy efficiency is crucial.
- The Cortex-A7 processor supports features like multi-core configurations, virtualization, and advanced power management.
IoT Gateway:
- An IoT gateway acts as a bridge between IoT devices and the cloud or other network infrastructure.
- Moreover, it also provides connectivity, protocol translation, data preprocessing, and security functionalities.
- The i.MX6 SOM module with its processing capabilities and rich set of peripherals makes it suitable for running IoT gateway software stacks and managing communication between devices and the cloud.
When using an ARM Cortex-A7 i.MX6 SOM module in an IoT gateway, you would typically:
- Design a PCB with the necessary power supply, memory, connectivity interfaces (Ethernet, Wi-Fi, etc.), and other peripheral components required for the IoT gateway functionality.
- Incorporate the BGA assembly process to mount the i.MX6 SOM module onto the PCB.
- Develop or install an operating system and software stack on the module to enable the IoT gateway functionality.
- Implement communication protocols, data preprocessing, and also security mechanisms.
ltem | Capability |
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Order Quantity | ≥1PC |
Quality Grade | IPC-A-610 |
Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
Size | 50*50mm~510*460mm |
Board Type | Rigid PCB, Flexible PCB, metal core PCB |
Min Package | 01005 (0.4mm*0.2mm) |
Max Package | No limit |
Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS, etc. |
Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
Component Sourcing | Turnkey (All components sourced by New Reach), Partial turnkey, Kitted/Consigned |
BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
SMT Parts Presentation | Cut Tape, Partial reel, Reel, Tube, Tray, Laser-cut Stainless Steel |
Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical and entertainment. |
Stencil | Stencil with or without frame (offered free by New Reach) |
Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
SMT Capacity | 3 Million~4 Million Soldering Pad/day |
DIP Capacity | 100 Thousand Pins/day |