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Capability
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Machine Capability
| ltem | Capability |
|---|---|
| Layer Count | 1-40layers |
| Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers4000、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material (including partial Ro4350B hybrid laminating with FR-4) |
| Board Type | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill, PCB Gold Finger |
| Board Thickness | 0.2-5.0mm |
| Copper Thickness | Min. 1/2 OZ, Max. 10 OZ |
| PTH Wall | 25um(1mil) |
| Maximum Board Size | 1100*500mm(43”*19”) |
| Min laser drilling size | 4mil |
| Min. Spacing/Tracing | 2.7mil/2.7mil |
| Solder Mask | Green, Black, Blue, Red, White, Yellow, Purple matte/glossy |
| Surface Treatment | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead-free 、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP, ENIG+Gold finger, Flash gold(electroplated gold)+Gold finger(50u”), Immersion silver+Gold finger, Immersion Tin+Gold finger |
| Min. Annular Ring | 3mil |
| Aspect ratio | 10:1(HASL Lead-free 、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) |
| Impedance control | ±5ohm(<50ohm), ±10%(≥50ohm) |
| Other Techniques | Blind/Buried Via, Gold Fingers, Press Fit, Via in Pad, Electrical Test |
